Mo-la Molybdenum Lanthanum Alloy Plate for Powder Metallurgy Metal
Product Description After add rare earth oxide containing La into molybdenum powder, recrystallization temperature of products will raise notably, high temperature resistance performance and longer service life than pure molybdenum products. And this series of products are widely used as electric light source part, high temperature electro-heat device, etc.
Lanthanum content: 0.4-0.6%
Dimension: according to your requirement.
Technology ,Standard: ASTM B 386-03
2,Size: 0.2*300*300mm
3,MOQ:5kgs
surface of molybdenum lanthanum alloy plate we produce is smo
Standard: ASTM B 386-03
2,Size: 0.2*300*300mm
3,MOQ:5kgs
surface of molybdenum lanthanum alloy plate we produce is smo
Product NameMolybdenum Lanthanum Mo-La Plate
Size TK 0.1~80mm*W 10~600mm*L 30~1000mm
Use temperature 1800°C
Highest temperature 2200°C
Molybdenum Lanthanum Mo-La Plate
Size TK 0.1~80mm*W 10~600mm*L 30~1000mm
Use temperature 1800°C
Highest temperature 2200°C
ApplicationMo-la plate is used for heating element, heat shield, sintered tray, sintered boat, folded plate, bottom plate, sputtering target, electronic and crucible for vacuum
Advantage of our Molybdenum Lanthanum Mo-La Plate
- long term stock for your ready choice
- bright and chemically cleaned surface with quality.
- Standard tolerence (or according to your requirement )
Related Products
We're professional manufacturer of molybdenum and tunsten products, MoSi2 and SiC heating element, laboratory furnace. We can produce as per customer's request.
Our products include
99.95% Pure molybdenum sheets/plate for sapphire crystal growth
Molybdenum sheets from 0.005 inches to 0.150 inches in thickness is classified
As molybdenum refractory sheet. It is used for fabrication of sintering boats,
High temperature furnace heating elements and heat shields.
Molybdenum plates from 0.187 inches to 3 inches in thickness is classified as
Molybdenum refractory plate. It is widely used in the construction of furnace tooling
And parts and as a feed stock for the fabrication of parts for the electronics and
Semiconductor industries,
Specification:
Purity: >=99.95%
Density: >=10.1g/cm3
Thickness: >=0.1mm
Width: 20-600mm
Length: Less than 2000mm
Grade: Mo1, TZM, Mo-La
Standard: ASTM, GB3876-83
Surface: Hot rolls, bright, ground
Characteristics:
High melting point(2610C), high strength,
High level of thermal conductivity,
A low coefficient of thermal expansion,
Excellent resistance to oxidation at high temperatures,
Excellent resistance to electrochemical corrosion,
Chemical Composition |
Important elements Contents% |
Other elements content(%) |
C |
Ti |
Zr |
Si |
Fe |
Ni |
N |
Mo |
+ 0.40-0.55% |
+ 0.06-.012% |
+ 0.01-0.04% C |
≤0.006 |
≤0.01 |
≤0.005 |
≤0.003 |
≥99.20% |